📋 REAL PUBLIC UCC-1 FILING RECORD
Hi-Tech Packaging Inc
Jurisdiction: CT
Secured Capital Lender
Michael Rappa
Filing Date
2026-08-19
📋 Registered Collateral (from the public UCC-1 filing):
"Equipment Financing (lender: Michael Rappa)"
🤖 Sample Outreach TemplateExample — not generated for Hi-Tech Packaging Inc
Subject: Operational solutions for Hi-Tech Packaging Inc's expansion
Hi [Executive First Name],
Notice that Hi-Tech Packaging Inc recently filed a UCC-1 in CT for "Equipment Financing (lender: Michael Rappa)...".
Our autonomous AI agent team helps expanding companies in CT streamline operations and scale vendor pipelines with zero manual effort.
Would you be open to a 5-minute chat this Thursday at 10 AM EST?
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